T.L Viancos : rechercher sur Z-Library

Paul T. Vianco, Jerome A. Rejent, Arlo F. Fossum, Michael K. Neilsen

Année:

2018

Langue:

english

Fichier:

PDF, 12.98 MB

english, 2018

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2007

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2007

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava

Journal:

Vianco, P.T., Sifford, C.H., Romero, J.A.

Année:

2004

Langue:

english

Fichier:

PDF, 2.15 MB

english, 2004

Resistivity and adhesive strength of thin film metallizations on single crystal quartz

Journal:

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control

Année:

1997

Langue:

english

Fichier:

PDF, 1.62 MB

english, 1997

Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

Artaki, I., Jackson, A.M., Vianco, P.T.

Journal:

Soldering & Surface Mount Technology

Année:

1995

Langue:

english

Fichier:

PDF, 634 KB

english, 1995

The impact of process parameters on gold elimination from soldered connector assemblies

Vianco, P.T., Kilgo, A.C.

Journal:

Soldering & Surface Mount Technology

Année:

2000

Langue:

english

Fichier:

PDF, 312 KB

english, 2000

Behavior of Lead-Free Solder Under Thermomechanical Loading

Wei, Y., Chow, C. L., Lau, K. J., Vianco, P., Fang, H. E.

Journal:

Année:

2004

Langue:

english

Fichier:

PDF, 459 KB

english, 2004

Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates

D. F. Susan, J. A. Rejent, P. F. Hlava, P. T. Vianco

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 683 KB

english, 2009

Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 2.48 MB

english, 1999

Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

Journal:

Paul T. Vianco, Jerome A. Rejent, Joseph J. Martin

Année:

1999

Langue:

english

Fichier:

PDF, 2.28 MB

english, 1999

The compression stress-strain behavior of Sn-Ag-Cu solder

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2003

Langue:

english

Fichier:

PDF, 282 KB

english, 2003

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

I. Artaki, A. M. Jackson, P. T. Vianco

Journal:

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo

Année:

1994

Langue:

english

Fichier:

PDF, 1.16 MB

english, 1994

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Journal:

D. R. Frear, P. T. Vianco

Année:

1994

Langue:

english

Fichier:

PDF, 1.66 MB

english, 1994

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Journal:

Schmid, Christopher R., Bryant, Jerry D., Dowlatzedah, Mandy, Phillips, Joseph L., Prather, Douglas E., Schantz, Renee D., Sear, Nancy L., Vianco, Catherine S.

Année:

1994

Langue:

english

Fichier:

PDF, 4.62 MB

english, 1994

Synthesis of 2,3-O-isopropylidene-D-glyceraldehyde in high chemical and optical purity: observations on the development of a practical bulk process

Journal:

Journal of Organic Chemistry

Année:

1991

Langue:

english

Fichier:

PDF, 480 KB

english, 1991

[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Ray, U., Artaki, I., Vianco, P.T.

Année:

1994

Langue:

english

Fichier:

PDF, 986 KB

english, 1994

Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

Vianco, P.T., Stephens, J.J., Rejent, J.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Année:

1997

Langue:

english

Fichier:

PDF, 465 KB

english, 1997

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Acceleration models, constitutive equations, and reliability of lead-free solders and joints

Lau, J., Danksher, W., Vianco, P.

Année:

2003

Langue:

english

Fichier:

PDF, 584 KB

english, 2003

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

Pierce, David M., Sheppard, Sheri D., Vianco, Paul T., Regent, Jerome A., Grazier, J. Mark

Journal:

Pierce, David M., Sheppard, Sheri D., Vianco, Paul T.

Année:

2008

Langue:

english

Fichier:

PDF, 1.87 MB

english, 2008

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

Journal:

Pierce, David M., Sheppard, Sheri D., Fossum, Arlo F., Vianco, Paul T., Neilsen, Mike K.

Année:

2009

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2009

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

Journal:

Microscopy and Microanalysis

Année:

2008

Langue:

english

Fichier:

PDF, 731 KB

english, 2008

Failure Analysis of Crimp Connectors

Vianco, P, Kilgo, A, Grant, R

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 17.09 MB

english, 2011

A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects

Vianco, P.T., Rejent, J.A.

Journal:

Soldering & Surface Mount Technology

Année:

2002

Langue:

english

Fichier:

PDF, 971 KB

english, 2002

A Practical Viscoplastic Damage Model for Lead-Free Solder

Fossum, A. F., Vianco, P. T., Neilsen, M. K., Pierce, D. M.

Journal:

Neilsen, Michael K., Vianco, Paul T.

Année:

2006

Langue:

english

Fichier:

PDF, 340 KB

english, 2006

UCPD Model for Pb-Free Solder

Journal:

Materials Science and Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2014

A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Vianco, Paul T.

Journal:

JOM

Année:

2018

Langue:

english

Fichier:

PDF, 6.89 MB

english, 2018

Negative creep in an amorphous metallic alloy

P.T. Vianco, J.C.M. Li

Journal:

Année:

1987

Langue:

english

Fichier:

PDF, 948 KB

english, 1987

Interface reactions between 50In–50Pb solder and electroplated Au layers

P. Vianco, G. Bryant, P. Hlava, G. Zender

Journal:

Materials Science and Engineering: A

Année:

2005

Langue:

english

Fichier:

PDF, 1.32 MB

english, 2005

Interface flow mechanism for tin whisker growth

H.P. Howard, J. Cheng, P.T. Vianco, J.C.M. Li

Journal:

Acta Materialia

Année:

2011

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2011

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

P. T. Vianco, A. C. Kilgo, R. Grant

Journal:

P. T. Vianco, J. C. M. Li

Année:

1995

Langue:

english

Fichier:

PDF, 1.06 MB

english, 1995

Annealing of shear bands in metallic glasses

Journal:

Année:

1987

Langue:

english

Fichier:

PDF, 2.69 MB

english, 1987

An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis

Jing Cheng, Paul T. Vianco, Joeseph Subjeck, James C. M. Li

Journal:

Paul T. Vianco, Robert D. Wright, Paul F. Hlava, Joseph J. Martin

Année:

2011

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2011

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Journal:

Paul T. Vianco, Joseph J. Martin, Robert D. Wright, Paul F. Hlava

Année:

2006

Langue:

english

Fichier:

PDF, 532 KB

english, 2006

Solid-State Interface Reactions between Silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb Solders

Journal:

Paul T. Vianco, Jerome A. Rejent, Gary L. Zender, Paul F. Hlava

Année:

2007

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2007

Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Journal:

Paul T. Vianco, Jerome A. Rejent, Gary L. Zender, Paul F. Hlava

Année:

2010

Langue:

english

Fichier:

PDF, 1021 KB

english, 2010

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Journal:

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Année:

2010

Langue:

english

Fichier:

PDF, 971 KB

english, 2010

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Journal:

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent

Année:

2003

Langue:

english

Fichier:

PDF, 592 KB

english, 2003

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar

Journal:

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Année:

2003

Langue:

english

Fichier:

PDF, 288 KB

english, 2003

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition

Journal:

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Année:

2004

Langue:

english

Fichier:

PDF, 3.36 MB

english, 2004

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

Journal:

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent

Année:

2004

Langue:

english

Fichier:

PDF, 1.58 MB

english, 2004

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substrates

Journal:

Année:

2005

Langue:

english

Fichier:

PDF, 956 KB

english, 2005

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 542 KB

english, 2009

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 690 KB

english, 2009

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent, Carly George, Alice Kilgo

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 743 KB

english, 2010

Optimum Thickness of Sn Film for Whisker Growth

Jing Cheng, Fuqian Yang, Paul T. Vianco, Bei Zhang, James C.M. Li

Journal:

K. L. Erickson, P. L. Hopkins, P. T. Vianco

Année:

2011

Langue:

english

Fichier:

PDF, 633 KB

english, 2011

Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating

Journal:

Année:

1998

Langue:

english

Fichier:

PDF, 1.08 MB

english, 1998

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

P. T. Vianco, S. N. Burchett, M. K. Neilsen, J. A. Rejent, D. R. Frear

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 392 KB

english, 1999

The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

U. Ray, I. Artaki, H. M. Gordon, P. T. Vianco

Journal: